Product Description
0.45mm 250K Leaded BGA Solder Balls for PCB Rework
High-reliability industrial automation component tested and verified for mission-critical manufacturing, robotic automation, and CNC drive environments.
Technical Specifications
| Manufacturer Part Number (MPN) | 0.45MM 250K |
| Product Reference (SKU) | LEHIMTOPU-3 |
| Brand / Manufacturer | Industrial Automation |
| Hardware Condition | Factory New |
| Warranty Protection | 12-Month Factory Replacement Warranty |
| System Compatibility | BGA Reballing Stencils, SMD Rework Stations, Industrial Electronics Repair |
Quality Assurance & Functional Testing
Sphere diameter calibration verification, alloy purity and oxidation check.
Compatibility & Installation Notes
Apply high-grade BGA rework flux to PCB pads. Reflow according to leaded profile (peak ~215-225°C).
